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METHOD FOR GROWING HETEROEPITAXIAL LAYER ON COMPOUND SEMICONDUCTOR SUBSTRATE

机译:复合半导体衬底上异质外延层的生长方法

摘要

PURPOSE:To make it possible to prevent warp of semiconductor wafer by introducing instantly and rapidly cooling process in growing process when an epitaxial layer of a compound semiconductor different from that of a compound semiconductor substrate is grown on the substrate. CONSTITUTION:When an epitaxial layer of compound semiconductor such as GaAsP different from that of a compound semiconductor substrate is grown on the substrate such as GaP substrate, a high-frequency coil for heating of epitaxial growing device is turned off once or several times for about 1 minute to instantly cool the epitaxial layer and GaP layer and mixed crystal ratio- changing layer and mixed crystal ratio-fixing layer of GaAsP are successively grown.
机译:目的:通过在化合物衬底上生长不同于化合物半导体衬底的外延层的化合物半导体的外延层,在生长过程中引入即时而迅速的冷却过程,从而防止半导体晶片的翘曲成为可能。组成:当在化合物(例如GaP衬底)上生长不同于化合物半导体衬底的化合物半导体(例如GaAsP)的外延层时,用于加热外延生长器件的高频线圈将关闭一次或多次,持续约1分钟以立即冷却外延层和GaP层,并依次生长GaAsP的混合晶体比率改变层和混合晶体比率固定层。

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