METALLIC CONDUCTIVE FOIL OR METALLIC ALLOY CONDUCTIVE FOIL AND MANUFACTURE THEREOF

摘要

PURPOSE: To provide conductive foil high in the joining strength of a solder joint part and free from the generation of soldering balls. ;CONSTITUTION: In the objective metallic conductive foil or metallic alloy conductive foil, a solder film 50 with 1 to 50μm thickness constituted in such a manner that plural lead layers 31 and 32 and tin layers 41 and 42 are alternately laminated is formed on the surface 21 of foil body 20 constituted of metal or alloy essentially consisting of the metal. At the time of using one kind selected from gold, silver, platinum and palladium as the above-mentioned metal, the thickness of the solder film is regulated to 3 to 50μm, and at the time of using lead as the above-mentioned metal, the thickness of the solder film is regulated to l to 30μm as well as the thickness of the layer constituted of the adjacent one lead layer and tin layer is regulated to ≤8μm. Moreover, the objective conductive foil is manufactured by a vacuum deposition method.;COPYRIGHT: (C)1993,JPO&Japio