首页> 外国专利> METHOD OF EVALUATION BY FOREIGN MATERIAL INSPECTION DEVICE

METHOD OF EVALUATION BY FOREIGN MATERIAL INSPECTION DEVICE

机译:国外材料检验设备的评估方法

摘要

PURPOSE:To evaluate micro foreign materials by using a microscope to detect and store the position of each standard particle on a base for evaluation, and evaporating a solvent so as to reduce the diameter of each particle to below specific size for the preparation of the base for evaluation, and finding the rate of the number of detected particles of below the specific size using the base. CONSTITUTION:Standard particles 1 of diameter not more than 0.05mum are put in an organic solvent 2 in a container 13 on an ultrasonic vibrator 3 and are swelled by vibration and the solvent 2 and the particles 1 are sprayed to a semiconductor wafer 5. A standard mark particle 6 is attached and fixed on the wafer 5 and held against a wafer chuck 7. An XY stage 8 is moved and the position 11a of each particle 1 is detected and stored by an optic microscope 9 using the position of the particle 6 as a reference and then the temperature of the chuck 7 is raised to evaporate the solvent 2 and to reduce the diameter of each particle to not more than 0.05mum and the chuck 7 is used as a base 5 for evaluation. The base 5 for evaluation is put on a foreign material inspection device 18 and the standard particles are detected by the foreign material inspection device 18 and the rate of the number of the particles detected at a position detected by an observing system 9 is found so as to perform evaluation for foreign materials of diameter not more than 0.05mum.
机译:目的:通过使用显微镜检测和存储每个标准颗粒在基体上的位置进行评估,并蒸发溶剂以将每个颗粒的直径减小到特定尺寸以下以制备基体,从而评估微异物进行评估,并使用基数查找低于特定大小的被检测粒子的数量比率。组成:将直径不大于0.05μm的标准颗粒1放入超声波振子3上的容器13中的有机溶剂2中,并通过振动使其溶胀,并将溶剂2和颗粒1喷涂到半导体晶片5上。将标准标记颗粒6附着并固定在晶片5上,并保持在晶片卡盘7上。移动XY台8,并且使用颗粒6的位置通过光学显微镜9检测并存储每个颗粒1的位置11a。作为参考,然后升高卡盘7的温度以蒸发溶剂2并使每个颗粒的直径减小到不大于0.05μm,并且将卡盘7用作评估的基础5。将评价用基体5放置在异物检查装置18上,通过异物检查装置18检测标准粒子,求出在观察系统9所检测的位置处检测到的粒子数的比率,从而对直径不大于0.05μm的异物进行评估。

著录项

  • 公开/公告号JPH04366753A

    专利类型

  • 公开/公告日1992-12-18

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号JP19910142994

  • 发明设计人 NOGUCHI MINORU;KENBO YUKIO;

    申请日1991-06-14

  • 分类号G01N21/88;G01N21/93;G01N21/94;G01N21/956;G03F9/00;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-22 05:15:19

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号