PARTIAL PLATING METHOD FOR EMI SHIELD OF LOW ADHESION NONCONDUCTIVE MATERIAL

摘要

PURPOSE: To carry out partial plating for an EMI shield with excellent adhesion and fine appearance by coating a part requiring plating on a low adhesion nonconductive material with resin converted into a coating material and subjecting the part to electroless plating. ;CONSTITUTION: A part requiring plating on a low adhesion nonconductive material such as resin is coated with resin converted into a coating material. This resin coating material is obtd. by dissolving the resin in an org. solvent by about 50-800ml/l. The resulting coating film is dried, cured, etched and subjected to catalyst imparting treatment and activation treatment. The film is then washed and subjected to electroless plating with an electroless Cu or Ni plating soln. A plating film having excellent adhesion and fine appearance is formed on the low adhesion nonconductive material and partial plating for an EMI shield is attained.;COPYRIGHT: (C)1993,JPO&Japio