首页> 外国专利> ELECTRIC CONNECTING CONSTRUCTION BETWEEN CIRCUIT BOARD AND COMPONENT TO BE LOADED THEREON AND ELECTROMAGNETIC SHIELD CONSTRUCTION USING SAME TOGETHER WITH ELECTRONIC CIRCUIT MODULE PROVIDED WITH ELECTROMAGNETIC SHIELD

ELECTRIC CONNECTING CONSTRUCTION BETWEEN CIRCUIT BOARD AND COMPONENT TO BE LOADED THEREON AND ELECTROMAGNETIC SHIELD CONSTRUCTION USING SAME TOGETHER WITH ELECTRONIC CIRCUIT MODULE PROVIDED WITH ELECTROMAGNETIC SHIELD

机译:电路板和将要加载的组件之间的电连接构造以及电磁屏蔽构造,该构造与电磁屏蔽模块一起提供的电子电路模块一起使用

摘要

PURPOSE: To offer an electrically connecting structure able to connect and load electronic components to a substrate while improving certainty of mutual electric continuity by more simple operation. ;CONSTITUTION: A hole 8 is provided by making a substrate on a wiring pattern 2 formed on a circuit board 1 so as to go through the board 1 while providing a resin-made projection 10 convered by a conductor film 11 on the lower part of the components to be loaded on the circuit board 1 and tightly fitting the resin-made projection 10 into the hole 8 on the circuit board.;COPYRIGHT: (C)1993,JPO&Japio
机译:目的:提供一种电连接结构,该结构能够通过更简单的操作将电子组件连接并加载到基板上,同时提高相互电连续性的确定性。 ;组成:通过在形成于电路板1上的布线图案2上制作基板以使其穿过基板1,同时在其下部提供由导体膜11会聚的树脂制突起10,来提供孔8。将要装入电路板1上的组件和将树脂制凸出物10紧密地装配到电路板上的孔8中。;版权所有:(C)1993,JPO&Japio

著录项

  • 公开/公告号JPH0590428A

    专利类型

  • 公开/公告日1993-04-09

    原文格式PDF

  • 申请/专利权人 ROHM CO LTD;

    申请/专利号JP19910252064

  • 发明设计人 KOBAYASHI TAKASHI;TAKAYAMA NOBORU;

    申请日1991-09-30

  • 分类号H01L23/00;

  • 国家 JP

  • 入库时间 2022-08-22 05:12:59

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