SUPERPOLISHING AGENT, PROCESS FOR POLISHING HARD MATERIALS, AND POLISHED HARD MATERIALS

摘要

A process for superpolishing hard ceramic substrates, and superpolished substrates having surface finishes below about 20 angstroms RMS. In the first embodiment, the process comprises applying a pitch to a lap tool (10) and forming channels in the pitch. The pitch is wetted with a polishing compound comprising colloidal alumina and powder of a substance harder than that being polished. The substrate (17) is brought into contact with the wetted pitch, and relative motion is applied thereto to polish the substrate (17). In a second embodiment, microporous pads (12) are used which absorb the polishing compound and contact the substrate (17) to polish the same.