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Plastic encapsulated semiconductor device incorporating a heat sink of metal having controlled roughness contact surfaces, and method of making the same
Plastic encapsulated semiconductor device incorporating a heat sink of metal having controlled roughness contact surfaces, and method of making the same
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机译:包含具有受控粗糙度接触表面的金属散热器的塑料封装半导体器件及其制造方法
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摘要
A structure is disclosed which comprises a metal plate (12), a chip of a semiconductor material (13) attached to the plate (12), terminal rheophores (11), interconnection wires (18) between the rheophores (11) and the metallized regions (17) of the chip (13), and a plastics body (10) encapsulating all this with the exception of a surface of the plate (12) and part of the rheophores (11). To achieve improved bond between the plastics and the metal, predetermined areas (30,32,33) of the plate (12) and the rheophores (11) have a higher roughness than 1(Ra=1µm).
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