METHOD OF CONTROLLING AND STABILIZING AVERAGE CURRENT DENSITY IN ELECTROPLATING BATH

摘要

Usage: electroplating, in particular process control coating. SUMMARY OF THE INVENTION: pitayutimpulsnym bath voltage and stabilize the voltage between the additional electrode and the cathode was measured in the pause emym bath current, the stability of the voltage is increased by the use of information about the amount of electricity flowing through the bath in each pulse power bath. The method implemented by the device. Ustroy- GUSTs plating bath contains 1, the workpiece 2, an anode 3, For additional electrode 4, power switch 5, a master oscillator 6, the time pulse converter (TTI) 7, conditioners short pulses 8,9, sample-and-storing device UVH1 10 SHA2 11 UVHZ 13, summing amplifier 12, integrator 14, shunt 15, wherein the power switch 5 is connected to the input. plus voltage source and the output with the anode 3, the workpiece 2 is connected to the input of the integrator 14 and one end of the shunt 15, a second end koto-, cerned is combined with a common drive additional electrode 4 is connected to the inputs UVH1 SHA2 10 and 11, yield 10 UVH1 combined with the first input of the summing amplifier, the second output of the summing amplifier 12 connected to the output SHA2 11, connected to the third input voltage setpoint voltage Uo, the fourth - the output of sample-storage device 13. UVHZ fifth input is combined with the output of the integrator 14 and the input 13 UVHZ . summarizing the output th amplifier 12 is combined with the input VIP 7 strobirue- my input of which is connected to the oscillator output 6 and the input of the 8 output driver 8 is integrated with the control input SHA2 11 and the reset input of the integrator 14. The output signal 7 supplied to the TTI control input power the key 5 and the input of the driver 9, the output of which is combined with the control inputs 10 and UVH1 UVHZ 13. 1 yl. G ate about 00 th 00 th