Fixing integrated circuit element onto printed circuit - attaching IC to plastics film having conductive tracks, cutting out film, sticking onto printed circuit, and connecting tracks

摘要

The integrated circuit element (1) has contact pads (2) on the underside to which the elastic plastics film (3) with conductive tracks (4) is applied. The circuit contact pads align with the tracks which are locally raised by formed projections (5) e.g. of gold or of nickel with gold plating. The projections are formed in a photo lithographic process. The integrated circuit element is secured in position on the film be an adhesive layer (6) that is hardened by exposure to UV light while the element is pressed against the film. The position is readily adjusted before exposure and the connections checked. An area of film with the integrated circuit is cut out and stuck onto the printed circuit (7), and contact is made between the tracks and the printed circuit. ADVANTAGE - Allows circuit to be tested before final fixing.