Micro mechanical components prodn. bonding for semiconductor - by mechanically contacting components contg. ion plating applied adhesive layer on contact surfaces, avoiding high temp.

摘要

Bonding comprises mechanically contacting components (A,B), to be connected to a microsystem, having a layer (S) on the contact surfaces (F1,F2) applied by ion plating. The contact surfaces (F1,F2) of the coponents (A,B) have a pref. planarity of more than 50nm. The intermediate adhesive layer applied by ion plating is made of SiO2 and the carrier material (component B) pref. of Si. The connecting layer(s) exerts a compressive stress on the surfaces to be contacted. ADVANTAGE - The bonding avoids high process temps.