Automatic de-burring method for ink printing head made of semiconductor wafer - using ceramic pipe connected to vacuum pump, which moves on wafer surface scraping and sucking burrs

摘要

The ink printing heads are produced by creating holes (2) on a semiconductor wafer (1) with a laser. The deburring method involves holding the wafer in a frame. A ceramic pipe (4) connected to a vacuum pump is moved in the X, Y directions (6) automatically. The scraped burrs are sucked by the vacuum pump. Bending of the wafer may be compensated by the vacuum in the suction pipe. ADVANTAGE - Uniform de-burring and high yield.