首页> 外国专利> Mother and daughter circuit board arrangement - has lugs formed on daughter board locating in holes in mother board for connections

Mother and daughter circuit board arrangement - has lugs formed on daughter board locating in holes in mother board for connections

机译:母子电路板布置-在子板上形成凸耳,位于母板上的孔中以进行连接

摘要

A circuit board arrangement has a mother board (HP) onto which a daughter board (ZP) is mounted. The mechanical fixing of the boards is obtained by inserting lugs (EP) formed on the daughter board into matching apertures on the mother board. Connecting tracks on both boards are aligned and, when assembled, are permanently connected following immersion in a solder bath. The connecting lugs are separated by minimum distances. ADVANTAGE - High contact density.
机译:电路板布置具有在其上安装有子板(ZP)的母板(HP)。通过将子板上形成的凸耳(EP)插入母板上的匹配孔中,可以实现板的机械固定。两块板上的连接轨道均已对齐,并且在组装时将其浸入锡槽后永久连接。连接接线片相隔最小距离。优点-高接触密度。

著录项

  • 公开/公告号DE4236268A1

    专利类型

  • 公开/公告日1993-05-27

    原文格式PDF

  • 申请/专利权人 SIEMENS AG OESTERREICH WIEN AT;

    申请/专利号DE19924236268

  • 发明设计人 KOELZER WALTER WIEN AT;

    申请日1992-10-27

  • 分类号H05K1/14;H05K3/36;H05K3/42;

  • 国家 DE

  • 入库时间 2022-08-22 05:01:14

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