Anodic bonding of two substrates - comprises forming electroconductive film on one substrate and glass film on other substrate, joining and applying voltage

摘要

Anodic bonding process for bonding a 1st substrate (10) and a 2nd substrate (20) comprises: (a) forming an electrically conductive film (40) on the connecting surface of the 1st substrate; (b) forming a glass film on the connecting surface of the other substrate; (c) moving both substrates together; and (d) applying a voltage between the conductive film as anode and the glass film as cathode, whilst the two substrates are subjected to heat and pressure. Also claimed are: (i) prodn. of an ink jet printing head using the above process; and (ii) appts. with an ink jet printing head. USE/ADVANTAGE - The head is built into an electronic appts. e.g. a printer, word processor, a fax machine or a plotter. No blockages of individual ink channels arise.