;In a preferred embodiment the area on the top side of the cantilever beam corresponding to the remaining piece of wafer on the bottom side is bonded with a block of glass via 'mallory' bonding at about 300 C and 1000 V.;Furthermore, the surface of the wafer substrate and the trench can be coated in a first step with a material with nonconformal step coverage, and in a second step with a material with conformal step coverage. The cantilever beam and the tip are bared in the layer with conformal step coverage, and the supporting wafer and the layer with nonconformal step coverage are removed by selective etching through the bottom side mask.;The invention also comprises a micromechanical sensor for AFM/STM profilometry which is micromechanically manufactured from one piece of material."/>
公开/公告号DE68902141T2
专利类型
公开/公告日1993-02-25
原文格式PDF
申请/专利权人 IBM US;
申请/专利号DE1989602141T
发明设计人 BAYER THOMAS DE;WEISS HELGA DE;KRAUS GEORG DE;BARTHA JOHANN DR DIPL PHYS DE;GRESCHNER JOHANN DR DIPL-PHYS DE;WOLTER OLAF DR DIPL PHYS DE;
申请日1989-08-16
分类号G01N27/00;
国家 DE
入库时间 2022-08-22 05:01:06