首页> 外国专利> process for the manufacture mikromechanischer messfuehler for afm / stm profilometrie and mikromechanischer messfuehlerkopf.

process for the manufacture mikromechanischer messfuehler for afm / stm profilometrie and mikromechanischer messfuehlerkopf.

机译:afm / stm轮廓图和mikromechanischer messfuehlerkopf的mikromechanischer messfuehler的制造过程。

摘要

A method is described for producing micromechanical sensors for the AFM/STM profilometry, which consist of a cantilever beam with a tip at its end and a mounting block at the opposite, comprising: 1. bilaterally coating a wafer substrate with a layer of inorganic material ; 2. producing a mask for the desired cantilever beam pattern on the top side of the wafer and in the upper part of said layer; and a mask in said layer on the bottom side of the wafer, using a first photolithographic step and an etching step; 3. planarizing said cantilever beam pattern with photoresist; 4. producing a mask for the desired tip in the area of the cantilever beam pattern using a second photolithographic step, producing the desired tip using an etching step, and simultaneously transferring the cantilever beam pattern from the upper to the lower part of said layer; and 5. removing the supporting wafer material by anisotropic wet etching through the bottom side mask. In a second example a mask is produced for the desired cantilever beam pattern and the tip pattern. This mask which contains all relevant informations for a subsequent substrate etching process is transferred step by step into a silicon substrate. Between two successive substrate etching process steps there is a mask etching step which does not require an additional lithography step however. A third example describes a process for making monocrystalline monolithic silicon tips on silicon pedestals. The invention also comprises a micromechanical sensor for the AFM/STM profilometry which is micromechanically manufactured from one piece of material.
机译:描述了一种用于AFM / STM轮廓测量的微机械传感器的制造方法,该方法包括在其末端具有尖端的悬臂梁和在其相对的悬臂梁,其包括:1.在晶片衬底上双向涂覆一层无机材料。 ; 2.在晶片的顶侧和所述层的上部中产生用于所需的悬臂梁图案的掩模;使用第一光刻步骤和蚀刻步骤,在晶片底面上的所述层中形成掩模; 3.用光刻胶将所述悬臂梁图案平面化; 4.使用第二光刻步骤在悬臂梁图案的区域中产生用于所需尖端的掩模,通过蚀刻步骤产生所需尖端,并且同时将悬臂梁图案从所述层的上部转移至下部; 5.通过底面掩模通过各向异性湿法刻蚀去除支撑晶片材料。在第二示例中,为期望的悬臂梁图案和尖端图案制造掩模。包含用于后续衬底蚀刻过程的所有相关信息的该掩模被逐步转移到硅衬底中。在两个连续的基板蚀刻工艺步骤之间,存在掩模蚀刻步骤,但是该掩模蚀刻步骤不需要额外的光刻步骤。第三个示例描述了在硅基座上制造单晶单片硅尖端的方法。本发明还包括用于AFM / STM轮廓测量的微机械传感器,其由一件材料微机械地制造。

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