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Connection device having a very small pitch and method of manufacture

机译:节距非常小的连接装置及其制造方法

摘要

The subject of the present invention is a connection device which makes it possible to produce connections with a very small pitch. The device includes a plurality of parallel conductors (C), round wires or flat ribbons, each of these conductors being wired onto the same side (face) of a substrate (S) at both its ends (11, 12) so as to form a half-loop. Electrical contact, between the connector thus formed and the circuit (C) to be connected, is made by bringing contact pads (PC) on the circuit into elastic contact with the conductors (F) of the connector. IMAGE
机译:本发明的主题是一种连接装置,其使得可以以很小的间距产生连接。该装置包括多个平行导体(C),圆线或扁平带,这些导体中的每一个都在其两端(11、12)上布线到基板(S)的同一侧(面)。半循环。通过使电路上的接触垫(PC)与连接器的导体(F)弹性接触,可以在这样形成的连接器和要连接的电路(C)之间建立电接触。 <图像>

著录项

  • 公开/公告号FR2680284A1

    专利类型

  • 公开/公告日1993-02-12

    原文格式PDF

  • 申请/专利权人 THOMSON CSF;

    申请/专利号FR19910010178

  • 发明设计人 VAL CHRISTIAN;

    申请日1991-08-09

  • 分类号H01R12/57;H01R13/24;H05K3/32;

  • 国家 FR

  • 入库时间 2022-08-22 05:00:10

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