A device for encapsulating plastic material of a frame of the conductors of the circuit integrated and method of encapsulating.

摘要

Device (10) for the encapsulation of plastic material of a frame of the conductors of an integrated circuit (20). This device comprises an upper mold (12) and a bottom mold (14) which define, when they are correctly assembled, the region of encapsulation of the frame of the conductors, as well as a tank (16) of the molten plastic material (25, a pipe (18) and a volume of distribution (21) in order to ensure a uniform flow of the plastic material in the region of encapsulation of the moulds. The scope of the conductors comprises a hole of the flow (27) in order to enable the molten plastic material to pass from the duct to the volume of distribution and to the lower part of the region of encapsulation. The duct also makes it possible to the molten plastic material to flow directly to the upper part of the region of encapsulation. The plastic material being injected more uniformly in the same time in the upper and lower parts of the region of encapsulation, the risk of formation of a pocket of air, of cavities and other imperfections in the encapsulation is reduced.