首页>
外国专利>
METHOD OF FORMING DISCRETE SOLDER PORTIONS ON RESPECTIVE CONTACT PADS OF A PRINTED CIRCUIT BOARD
METHOD OF FORMING DISCRETE SOLDER PORTIONS ON RESPECTIVE CONTACT PADS OF A PRINTED CIRCUIT BOARD
展开▼
机译:在印刷电路板的相应接触板上形成离散焊料部分的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention provides for a method of forming discrete solder portions (16) on respective contact pads (10) whereby a strip of solder paste (12) is formed over a plurality of said pads (10). The strip (12) is formed with portions of reduced width (14) which are located over the spaces (22) between adjacent pads (10). The paste is melted and the surface tension at the portions of reduced width (14) causes the movement of solder towards the pads (10) and the separation of the strip (12) into discrete solder portions (16).
展开▼