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Surface topography optimization through control of chloride concentration in electroformed copper foil
Surface topography optimization through control of chloride concentration in electroformed copper foil
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机译:通过控制电铸铜箔中氯离子浓度来优化表面形貌
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摘要
An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.
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