Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same

摘要

The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.PPAccording to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short- circuit the conducting paths.PPTherefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.