Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path

摘要

A semiconductor device package is disclosed which facilitates the dissipation of heat generated by the enclosed semiconductor device. The package comprises a housing apparatus having a plurality of portions, a holding apparatus having a semiconductor device thermally attached, a thermal path formed within at least one of the portions of the housing apparatus, and a thermally conductive connection for thermally connecting the holding apparatus to the thermal path. The portions of the housing apparatus join together to form an enclosed chamber which encases the holding apparatus, the semiconductor device, and the thermally conductive connection. The thermal path thermally connects the interior of the package to the external environment. By thermally connecting the holding apparatus to the thermal path formed within the housing apparatus, a direct thermal path is created between the device and the external environment so that heat from the device may readily escape from the interior of the package.