Method for immobilizing semiconductors and noble metals on solid surfaces

摘要

A method is provided for immobilizing a semiconductor or noble metal material on a selected support material. In accordance with the method, the support is treated with a first solvent to clean and prepare the surface of the support. A powder slurry including fine particles of the semiconductor in a second solvent is then formed. The resultant slurry is applied to surface of the support. Subsequently, the slurry on the surface of the support is dried at room temperature to remove the second solvent to achieve an intermediate type of bonding between the semiconductor and the support surface.