LAMINATE BONDING METHOD AND LAMINATE BONDING DEVICE

摘要

PURPOSE: To obtain a bonding part superior in corrosion resistance without giving large thermal damage to an object to be bonded by a method wherein Au-Sn alloy-made solder layers are disposed on the surfaces of two alloy members forming an ink jet printing head, both the alloy members are made to adhere to each other with the solder layers in between, and the solder layers are melted. ;CONSTITUTION: A plurality of alloy members 210, 220 form an ink jet printing head. When the first surface of the member 210 (e.g. SUS304 plate) is bonded to the second surface of the member 220 (e.g. Ni plate), solder layers 211, 221 made of an Au-Sn alloy containing 20-40 mass % Sn and having a thickness of 1-10μm are provided on at least one of the first and second surfaces. The first surface is disposed opposedly to the second surface. After the relative position of the first surface and the second surface is adjusted, the both are made to adhere to each other. The solder layers are melted without melting both the alloy members to solder both the alloy members. As a result, a bonding part superior in corrosion resistance can be obtained.;COPYRIGHT: (C)1994,JPO