In the grinding wheel the ultrasonic vibration the precise compound grinding manner null which is superimposed the low frequency vibration

摘要

PURPOSE:To reduce the grinding force, by vibrating a grinding wheel in the rotary direction with low frequency while simultaneously vibrating in axial or radial direction with supersonic vibration thereby cutting chips finely and reducing the average grinding temperature rise. CONSTITUTION:Low frequency vibration 23F, A is applied in the rotary direction while supersonic vibration of frequency (f) and amplitude (as) is also applied in the rotary direction 34 onto a grinding wheel 35 an the circumferential speed V of said grinding wheel 35 is increased so as to grind a work 2 with the circumferential speed v. Consequently, the cutting length on a grinding face is minimized while the cutting depth in abrasive grains is varied intermittently so as to crush the chips finely thus producing a short period pulsating grinding force waveform having low pulsating grinding force. The pulsating grinding force waveform will be a heat pulsating waveform and does not heat the grinding face. Furthermore, a grinding mechanism for smoothing the grinding face through low frequency vibration in the direction of the grinding wheel while crushing the chips finely is additionally provided so as to smooth the surface.