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HIGH BREAKDOWN VOLTAGE PLANAR TYPE SEMICONDUCTOR DEVICE

机译:高击穿电压平面型半导体器件

摘要

PURPOSE:To attain the breakdown voltage at about several hundred volts with good yield by a mthod whereon guard ring structure and field plate stracture are combined and field plates are also provided for guard ring layers. CONSTITUTION:A field plate 61 consisting of a conductor layer maintained at the same potential as that of a diffusion layer 2 is arranged on an insulating film 3 located at the outside of a diffusion layer 2. Field plates 62, 63 consisting of conductor layers maintained at the same potential as that of guard ring layers 71, 72 are arranged on the insulating film 3 located at the outside of the guard ring layers 71, 72. With reverse bias applied to a substrate 1 and the diffusion layer 2, the potential at the plates 61, 62 becomes lower than the potential at the substrate right below the plates 61, 62. Therefore, the expansion of a depletion layer to the outside from the diffusion layer 2 becomes wide. Accordingly, breakdown voltage at about several hundred volts can be attained with good yield by sharing a predetermined voltage to the guard ring layers 71, 72 in accordance with reverse bias voltage.
机译:用途:为了通过一种方法获得大约几百伏的击穿电压,并具有良好的成品率,在该方法上结合了保护环结构和场板结构,并为保护环层提供了场板。组成:一个场板61,由保持与扩散层2相同电位的导体层组成,位于位于扩散层2外侧的绝缘膜3上。场板62、63由保持的导体层组成在与保护环层71、72相比位于外侧的绝缘膜3上,以与保护环层71、72相同的电位配置。在对基板1,扩散层2施加反向偏压的情况下,板61、62变得比板61、62正下方的基板上的电位低。因此,耗尽层从扩散层2向外部的膨胀变宽。因此,通过根据反向偏置电压将预定的电压共享给保护环层71、72,可以以良好的成品率获得大约几百伏的击穿电压。

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