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re - zadaio - do assembly body datum level process manner and device

机译:re-zadaio-做装配体基准层的工艺方法和装置

摘要

PURPOSE:To improve workability, to improve quality and to decrease the costs components, by holding a laser diode assembly on a gimbal for light emitting direction, measuring the ceutral position of the light emission and the emitting direction of the emitted laser light, adjusting aud positioning the direction of the emitted laser light, and thereafter vertically cutting the reference surface of the laser diode assembly. CONSTITUTION:A laser diode assembly 6 is attached to a specified position on a gimbal 7 by a loader 11. Light is emitted from a laser diode I by a control device 13. The emitted laser light (a) from the laser diode 1 is detected by a position sensor 10 through a measuring optical system 9 comprising a lens system. Thus the central position of light emission is measured. Then the gimbal 7 is moved in the (x)-(z) directions, and the central position of the light emission in the laser diode assembly 6 is adjusted to a reference position with respect to the measuring optical system 9. Thereafter the direction of the emitted laser light is detected by a plurolity of photodiodes 8, and the direction of the emitted laser light is aligned with the reference direction of the measuring optical system 9. Then, a reference surface 3 of the laser diode assembly is cut aud machined with a cutter 12.
机译:目的:通过将激光二极管组件固定在万向支架上的发光方向,测量发光的中心位置和发出的激光的出射方向,从而提高可加工性,提高质量并降低成本,从而降低噪音。定位发射激光的方向,然后垂直切割激光二极管组件的参考面。组成:一个激光二极管组件6通过装载器11固定在万向架7上的指定位置。光通过控制装置13从激光二极管I发出。检测到从激光二极管1发出的激光(a)。通过位置传感器10通过包括透镜系统的测量光学系统9来实现。因此,测量了发光的中心位置。然后,使万向架7沿(x)-(z)方向移动,并且将激光二极管组件6中的光发射的中心位置相对于测量光学系统9调整到参考位置。发射的激光被多个光电二极管8检测到,并且发射的激光的方向与测量光学系统9的参考方向对齐。然后,用激光切割激光二极管组件的参考表面3并对其进行机加工。切刀12。

著录项

  • 公开/公告号JPH069271B2

    专利类型

  • 公开/公告日1994-02-02

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号JP19860072447

  • 发明设计人 TACHIBANA SUSUMU;SUZUKI NOBUO;

    申请日1986-04-01

  • 分类号H01S3/18;

  • 国家 JP

  • 入库时间 2022-08-22 04:53:39

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