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re - zadaio - do assembly body datum level process manner and device
re - zadaio - do assembly body datum level process manner and device
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机译:re-zadaio-做装配体基准层的工艺方法和装置
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摘要
PURPOSE:To improve workability, to improve quality and to decrease the costs components, by holding a laser diode assembly on a gimbal for light emitting direction, measuring the ceutral position of the light emission and the emitting direction of the emitted laser light, adjusting aud positioning the direction of the emitted laser light, and thereafter vertically cutting the reference surface of the laser diode assembly. CONSTITUTION:A laser diode assembly 6 is attached to a specified position on a gimbal 7 by a loader 11. Light is emitted from a laser diode I by a control device 13. The emitted laser light (a) from the laser diode 1 is detected by a position sensor 10 through a measuring optical system 9 comprising a lens system. Thus the central position of light emission is measured. Then the gimbal 7 is moved in the (x)-(z) directions, and the central position of the light emission in the laser diode assembly 6 is adjusted to a reference position with respect to the measuring optical system 9. Thereafter the direction of the emitted laser light is detected by a plurolity of photodiodes 8, and the direction of the emitted laser light is aligned with the reference direction of the measuring optical system 9. Then, a reference surface 3 of the laser diode assembly is cut aud machined with a cutter 12.
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