METHOD FOR ELECTROPLATING ALUMINUM AND ALUMINUM ALLOY WITH PURE ZN EXCELLENT IN PLATING ADHESION

摘要

PURPOSE: To electroplate aluminum and aluminum alloy with pure Zn as a substrate plating excellent in plating adhesion at a low current density. ;CONSTITUTION: Aluminum and aluminum alloy 1 are plated with pure Zn having excellent plating adhesion. In this case, plating is performed in a plating soln. contg. ≤250g/l of zinc ion and ≤24g/l of sulfuric acid at a low current density of ≤4A/dm² The plating film 2 thus formed is used as the substrate plating, and a plating 3 is further formed thereon in a plating soln. contg. zinc ion and sulfuric acid at a high current density of ≥100A/dm².;COPYRIGHT: (C)1994,JPO&Japio