OXYGEN-CONTAINING MODIFIED PHENOLIC RESIN, EPOXY RESIN-CONTAINING MODIFIED PHENOLIC RESIN MOLDING MATERIAL AND SEMICONDUCTOR-SEALING MATERIAL

摘要

PURPOSE: To obtain the subject resin excellent in resistances to corrosion, heat, and moisture and useful for semiconductor-sealing material, etc., by mixing a petroleum oil, etc., with formaldehyde polymer, adding a phenol compound to the mixture, subjecting the mixture to a polycondensation reaction and subsequently extracting the polycondensation product with a solvent. ;CONSTITUTION: (A) 1 Mole of a petroleum heavy oil or pitch having a fa value of equation I of 0.4-0.95, and a Ha value of equation II of 20-80 is mixed with (B) formaldehyde polymer in an amount of 1-15 moles expressed in terms of formaldehyde, and heated in the presence of an acidic catalyst with stirring. The reaction product is mixed with (C) a phenolic compound at an addition rate of 0.05-5wt.% per 100wt.% of A+B in an A/C molar ratio of 1/0.3-5 and then subjected to a polycondensation reaction. The polycondensation product is subjected to the removal of components soluble in 1-10C aliphatic hydrocarbons and then extracted with an extracting solvent having an acid catalyst-dissolving degree of ≤0.1 and capable of dissolving a major part of the modified phenolic resin to provide the objective resin. The objective resin is preferably compounded with a curing agent and an epoxy resin.;COPYRIGHT: (C)1994,JPO&Japio