MOLDING MATERIAL, ELECTRICAL/ELECTRONIC PART MATERIAL AND SEMICONDUCTOR SEALING MEDIUM WHICH CONTAIN HIGHLY REACTIVE MODIFIED PHENOLIC RESIN AND EPOXY RESIN

摘要

PROBLEM TO BE SOLVED: To provide a modified phenolic resin molding material which has a low melt viscosity and good moldability, excellent dimensional stability, heat resistance, and the like, and low hygroscopicity due to the use of a highly reactive modified phenolic resin having high reactivity with an epoxy resin and is useful as a electrical/electronic part material and a semiconductor sealing medium. SOLUTION: The modified phenolic resin molding material comprises a highly reactive modified phenolic resin obtained by mixing a heavy oil or a pitch as the stock oil, 0.3-10 mol phenolic compound, 0.2-9 mol formaldehyde compound in terms of formaldehyde, and 0.01-3.0 mol acid catalyst all based on one mol of the stock oil and calculated from the average molecular weight of the oil, heating and stirring the resulting mixture to effect the polycondensation of the above components, and an epoxy resin.