Process for producing highly reactive modified phenolic resin, and containing the highly reactive modified phenolic resins, molding materials, electric and electronic parts and semiconductor materials for the sealing member

摘要

PROBLEM TO BE SOLVED: To obtain by one process a low viscous resin for forming a molded article with excellent heat resistance, moisture resistance, corrosion resistance, adhesion, dimensional stability, and strengths, by mixing a heavy oil or a pitch, a phenol, and a formaldehyde compd. in the presence of an acid catalyst, then by stirring with heating them. ;SOLUTION: Mixing and stirring one mole of a heavy oil or a pitch having a true b. p. of 180-500°C, and an aromatic hydrocarbon fraction value fa of 0.40-0.95, an aromatic hydrogen amt. value Ha of 20-80%; 0.3-10 moles of a phenol such as hydroxybenzene or hydroxynaphthalene; 0.2-9 moles in terms of formaldehyde of a formaldehyde; and 0.01-3 moles of an acid catalyst of a 15-50 mesh spherical, acidic cation-exchange resin at 50°C or below, gives a mixture. This mixture is heated gradually up to 50-200°C, then is subjected to polycondensation reaction for 15 min to 8 hr to give a highly reactive modified-phenol resin. This resin is used in combination with an epoxy resin.;COPYRIGHT: (C)1999,JPO