Cutting process and device null of the monocrystal ingot by the inner circumference blade

摘要

PURPOSE:To make it possible to obtain a wafer being warped little, by controlling the speed of cutting in a single-crystal ingot to be high and low alternately and repeatedly. CONSTITUTION:The speed of cutting in a single-crystal ingot 6 is controlled to be high and low alternately and repeatedly. An operation of a cut-in feeding unit 5 is controlling by a controller 8 and the moving speed of the cut-in feeding unit 5, i.e., the speed of cutting in the single-crystal ingot 6, is controlled in accordance with a program inputted beforehand in the controller 8. By this method, minute indentation is formed on the surface of a wafer, and by passing the wafer through lapping and etching process, the wafer being warped little can be obtained.