Electronic Package Assembly with a channel to release efforts.

摘要

The present Invention provides a package of electronic Assembly (40) which has a lead frame (12) and a buffer (18) attached to a base metal (42).To reduce the effort generated by the difference in the coefficients of thermal expansion, the buffer (18) mounted on a pedestal (43).The section area trnasversal pedestal (43) is lower than that of the buffer (18), such that at least a portion of the buffer (18) hangs or protruding pedestal (43).