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Electroless Tin Plating Method of Hydrogen Storage Alloy Powder for Electrode

机译:储氢合金粉电极的化学镀锡方法

摘要

The present invention relates to a method for producing LaNi5And MmNi5Electrolytic tin plating is performed to increase the electrical conductivity, thermal conductivity and moldability of the hydrogen storage alloy powder of the system. LaNi5And MmNi5Based hydrogen storage alloy powder was subjected to ultrasonic degreasing for 2 minutes in an acetone solution to obtain SnCl2And PdCL2For about 2 minutes, and then 10% H2SO4And the electrodeposition of the hydrogen storage alloy powder for electrodes to be subjected to the chemical plating treatment so that the precipitation rate can be precipitated at a rate of 46.6 mg in a plating solution at room temperature made of a composition of 55 gr / l of thiourea and 39 gr / It is a Hezzhai plating method.
机译:本发明涉及一种生产LaNi 5 和MmNi 5 的方法。进行电解镀锡以增加该合金的储氢合金粉末的电导率,导热率和可成型性。系统。将LaNi 5 和MmNi 5 基储氢合金粉末在丙酮溶液中进行超声波脱脂2分钟,得到SnCl 2 和PdCL < Sub> 2 约2分钟,然后用10%H 2 SO 4 和用于电极的储氢合金粉末进行电沉积通过化学镀处理,使得在由55克/升的硫脲和39克/升的组成组成的室温下,在镀液中以46.6毫克的速率沉淀出沉淀速率,这是一种Hezzhai电镀方法。

著录项

  • 公开/公告号KR940004077A

    专利类型

  • 公开/公告日1994-03-14

    原文格式PDF

  • 申请/专利权人 배순훈;

    申请/专利号KR19920013938

  • 发明设计人 최성수;

    申请日1992-08-03

  • 分类号C23C18/31;

  • 国家 KR

  • 入库时间 2022-08-22 04:38:02

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