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Acidic Electroless Copper Plating Method of Hydrogen Storage Alloy Powder for Electrode

机译:储氢合金粉的酸性化学镀铜方法

摘要

The present invention relates to a method for plating a hydrogen storage alloy powder, which is one of the hydrogen rectangle alloy electrode materials, in which a degreased hydrogen storage alloy powder is impregnated with 10% H2SO4Which is an acidic electroless copper plating method for an electrode hydrogen storage alloy powder which is subjected to an accelerated treatment in an aqueous solution for about 30 seconds and then subjected to copper electroless plating with a weakly acidic electroless plating solution at pH 5 to 6 and at a temperature of 70C.
机译:本发明涉及一种镀氢合金粉末的方法,该储氢合金粉末是一种氢矩形合金电极材料,其中将脱脂的储氢合金粉末浸渍有10%的H 2 SO < Sub> 4 这是一种用于电极储氢合金粉末的酸性化学镀铜方法,该方法在水溶液中进行加速处理约30秒,然后通过弱酸性化学镀覆进行铜化学镀溶液的pH值为5至6,温度为70℃。

著录项

  • 公开/公告号KR940004078A

    专利类型

  • 公开/公告日1994-03-14

    原文格式PDF

  • 申请/专利权人 배순훈;

    申请/专利号KR19920013937

  • 发明设计人 최성수;

    申请日1992-08-03

  • 分类号C23C18/38;

  • 国家 KR

  • 入库时间 2022-08-22 04:38:02

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