Power component module for electronic control device - uses sidewall of control device housing as heat sink for dissipating waste heat generated by power components

摘要

The module has at least one electronic power component (11) mounted on an electronic control circuit board (10) so that it lies in contact with the inside face (34) of one of the outer sidewalls of the housing (30) of the control device, acting as a heat sink for dissipating the waste heat generated by the power component. The power component is mounted on the circuit board via a fixing element (12). A spring (27) is used to press the power component into firm contact with the housing sidewall. ADVANTAGE - Rapid, good heat dissipation without requiring additional cooling elements. Can be built into housing of control unit. Power components can be plugged in by hand or automatically from above in simple manner during mounting.