首页> 外国专利> Conditioning esp. densifying reusable plastics, esp. expanded polystyrene - by grinding and rounding particles by repeated contact with surface at temp. below m.pt., avoiding damage

Conditioning esp. densifying reusable plastics, esp. expanded polystyrene - by grinding and rounding particles by repeated contact with surface at temp. below m.pt., avoiding damage

机译:调节,特别是致密化可重复使用的塑料,特别是膨胀聚苯乙烯-通过在温度下反复与表面接触将颗粒研磨和修圆。低于熔点,避免损坏

摘要

In a conditioning process, esp. for increasing the bulk density of re-usable plastics material (I), esp. expanded polystyrene (PS), is first ground to particle (II) of a size suitable for the end prod. The novelty is that (II) are then rounded by repeated contact with a surface (III) at a temp. below their m.pt. (II) impinge on (III), pref. at an angle less than 90 deg. and pref. at high speed so that they rebound, and the speed and temp. pref. are selected to prevent (II) sticking to (III). The (III) temp. is above the softening temp. but at least ca. 30 deg.C below the m.pt. of (II); pref. 70-130, esp. 90-110 deg.C for PS. During rounding, (II) also impinge on a surface at or below room temp. and are rotated. ADVANTAGE - (II) are densified to the required bulk density and the surface is freed from fibrous material, which can block mould nozzles in the foaming process, so that these need cleaning up to once a week. There is no loss of foaming capacity or other damage, since rounding is carried out at a lower temp. than usual.
机译:在调节过程中,尤其是用于增加可重复使用的塑料材料(I)的堆积密度,特别是首先将膨胀的聚苯乙烯(PS)研磨成适合最终产品尺寸的颗粒(II)。新颖之处在于,然后通过在一定温度下与表面(III)反复接触,将(II)修圆。低于他们的熔点(II)撞击(III),首选项。小于90度的角度和偏好。使其高速回弹,以及速度和温度。偏好选择以防止(II)粘在(III)上。 (III)温度高于软化温度。但至少是在熔点以下30摄氏度(II);偏好70-130,尤其是PS的90-110摄氏度。在舍入过程中,(II)还会在室温或低于室温的温度下撞击表面。并旋转。优势-(II)被压实至所需的堆积密度,并且表面没有纤维状材料,这会在发泡过程中阻塞模具喷嘴,因此需要每周清洁一次。由于在较低温度下进行磨圆,因此不会损失发泡能力或其他损害。比平常。

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