Copper@ alloy contact backing material for semiconductor use - has excellent adhesion compared to epoxy resin sealants, and contains nickel@, silicon, zinc@, magnesium@, tin@, etc.

摘要

A Cu-alloy contact backing material for use in resin-encapsulated semiconductor devices has the compsn. in wt.%: 1-4 Ni, 0.1-1 Si, 0.1-2 Zn, 0.001-0.05 Mg, 0.05-1 Sn, balance Cu plus impurities, namely max. 20 ppm S and max. 20 ppm C. Pref. compsn. in wt.% is 2.0-3.8 Ni, 0.3-0.9 Si, 0.2-1.5 Zn, 0.003-0.03 Mg, 0.15-0.8 Sn, balance Cu and impurities, namely max. 15 ppm S and max. 10 ppm C. ADVANTAGE - Excellent adhesion strength compared to epoxy resin sealants.