Low cost copper@ alloy for e.g. semiconductor carrier - contains zinc@, silicon, iron@, aluminium@, phosphorus@ and copper@

摘要

Cu alloy contg. 13-18% Zn, 1-2% Si, 0.1-0.4% Fe, 0.1-1.0% Al, 0.02-0.1% P, remainder Cu and impurities, is used for electronic components, partic. semiconductor carriers and plug connectors. The alloy has a tensile strength of 400-1100 MPa, and electrical conductivity of 6-7 MS/m and a spring bending limit of 150-900 MPa at an elastic modulus of 120 GPa max. ADVANTAGE - Favourable combination of properties and price.