Semiconductor device package with chip-specific data label - enables chip to be distinguished from others of same origin by reference to metallic plate attached after encapsulation

摘要

The package (1) encloses a chip (3) and a lead frame formed in one piece with a number of leads (2). The chip is bonded (7) to the upper surface of a carrier plate (5) and connected to the leads by metallic wires (4) from its bond pads. The chip and frame are encapsulated in synthetic resin (6) to form a package of the prescribed shape. A small metallic plate (20) pref. under the carrier displays e.g. the manufacturer's name, lot number, wafer number and x-y coordinates, electrical selection sorting and final test data. USE/ADVANTAGE - Labelling chip with brand name, date, nationality of manufacturer, etc.. Basis of operational fault in chip can be elucidated easily so that proper treatment can be given when fault occurs in-circuit.