Electrically heated desoldering unit having adjustable stop means preventing circuit board damage for desoldering electronic components having rows of leads

摘要

A specialized desoldering unit head is provided for the limited purpose of removing high-density solid state electronic components from circuit boards in a single step, without damaging the circuit board. In the typical case of a four-sided component with a row of leads on each side, the unit includes an electrically heated head which fits over the component with a heat-conducting blade fitting over each of the rows on the four sides of the component. The head has depth limiters stop means formed by at least one adjustable screw threaded through at least one laterally extended cross-strap on the head and positioned to engage against the top of the component to limit the lowering of the heated blades relative to the rows of leads so that the heated blades do not touch the circuit board, or even the horizontal portion of the surface- mounted leads of the lead rows, but only mounds of solder which have been applied over the leads to facilitate their heating and the removal of the component.