Printed circuit board desoldering method, desoldering apparatus and carrier
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机译:印刷电路板的拆焊方法,拆焊装置及载体
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摘要
PROBLEM TO BE SOLVED: To efficiently remove solder in a short time by scrubbing the soldered surface on a printed circuit board and removing the solder. SOLUTION: A carrier 2 holds the printed circuit board 1 and traveled in the arrow mark A direction. Hard wires of a rotating wire brush 7 shaves the solder. The solder remaining by the wire brush 7 shaving is removed with another wire brush 8. The shaven solder is formed as a powder-state and dropped into a vessel 10 and stored into a drower 11. The solder in the drawer 11 is taken out and recovered. The printed circuit board 1 is heated and it is desirable to shave the solder in the melting state of the solder with the wire brushes 7, 8. In order to heat the printed circuit board 1, it is desirable that the printed circuit board is uniformly heated with an infrared heater and locally heated at high temp. with a hot-blasting type main heater. It is desirable that the solder removing device is set in a tunnel type muffle.
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