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Printed circuit board desoldering method, desoldering apparatus and carrier

机译:印刷电路板的拆焊方法,拆焊装置及载体

摘要

PROBLEM TO BE SOLVED: To efficiently remove solder in a short time by scrubbing the soldered surface on a printed circuit board and removing the solder. SOLUTION: A carrier 2 holds the printed circuit board 1 and traveled in the arrow mark A direction. Hard wires of a rotating wire brush 7 shaves the solder. The solder remaining by the wire brush 7 shaving is removed with another wire brush 8. The shaven solder is formed as a powder-state and dropped into a vessel 10 and stored into a drower 11. The solder in the drawer 11 is taken out and recovered. The printed circuit board 1 is heated and it is desirable to shave the solder in the melting state of the solder with the wire brushes 7, 8. In order to heat the printed circuit board 1, it is desirable that the printed circuit board is uniformly heated with an infrared heater and locally heated at high temp. with a hot-blasting type main heater. It is desirable that the solder removing device is set in a tunnel type muffle.
机译:解决的问题:要在短时间内有效地清除焊料,方法是擦洗印刷电路板上的焊接表面并清除焊料。解决方案:托架2固定印刷电路板1并沿箭头A的方向移动。旋转钢丝刷7的硬线会刮除焊料。钢丝刷7剃刮后残留的焊锡用另一把钢丝刷8清除。剃刮后的焊锡呈粉末状,落入容器10中并储存在下垂机11中。取出抽屉11中的焊锡并取出。恢复了。加热印刷电路板1,并且期望用钢丝刷7、8在处于熔化状态的焊料中刮除焊料。为了加热印刷电路板1,期望印刷电路板是均匀的。用红外线加热器加热,并在高温下局部加热。带有热风式主加热器。期望将焊料去除装置设置在隧道式马弗炉中。

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