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Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid thermal processor

机译:在灯加热的快速热处理器中实时测量和控制晶圆温度和薄膜生长的方法和设备

摘要

An ellipsometer measures/monitors the change in polarization of light upon reflection from a wafer sample. The temperature of the wafer substrate surface and the film thickness are then simultaneously determined in situ using ellipsometry where the true wafer temperature is determined in real-time by the computer from a calculation based on the known temperature dependence of the refractive index of the wafer. The power output to the lamps is then adjusted accordingly to raise or lower the wafer temperature within the apparatus. This process continues automatically to maintain the desired temperature and film growth rate until the desired film thickness is achieved.
机译:椭偏仪测量/监视从晶片样品反射回来的光的偏振变化。然后使用椭圆光度法同时原位确定晶片衬底表面的温度和膜厚度,其中由计算机根据基于晶片折射率的已知温度依赖性的计算来实时确定真实晶片温度。然后,相应地调节输出到灯的功率,以升高或降低设备内的晶片温度。该过程自动继续以维持所需的温度和膜的生长速率,直到获得所需的膜厚度为止。

著录项

  • 公开/公告号US5313044A

    专利类型

  • 公开/公告日1994-05-17

    原文格式PDF

  • 申请/专利权人 DUKE UNIVERSITY;

    申请/专利号US19920874812

  • 发明设计人 RONALD K. SAMPSON;HISHAM Z. MASSOUD;

    申请日1992-04-28

  • 分类号B23K26/00;

  • 国家 US

  • 入库时间 2022-08-22 04:31:48

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