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Corrosion inhibition with CU-BTA

机译:CU-BTA的腐蚀抑制

摘要

A corrosion protecting film layer is formed on a non- passivating non- noble metal, such as cobalt, by placing the metal in a dilute solution of Cu.sup.+2 ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu.sup.+2 and 1 H-BTA results in a spontaneous interaction of Cu.sup.+2 and the metal to produce a film layer of Cu(I) BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.
机译:通过将金属放置在Cu + 2离子和苯并三唑(1 H-BTA)的稀溶液中,可在非钝化非贵金属(例如钴)上形成防腐蚀膜层。将金属暴露于含有Cu + 2和1 H-BTA的溶液中会导致Cu + 2与金属的自发相互作用,从而在金属表面上生成Cu(I)BTA膜层为金属创造永久的腐蚀保护。可以向溶液中添加硼酸盐缓冲液(例如硼酸和硼酸盐),以将溶液的pH值调整为8到9之间。

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