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Manufacturing method null of Al-Ti based alloy plated metal

机译:Al-Ti基合金电镀金属的制造方法无效

摘要

PURPOSE:To obtain a dense and smooth Ti alloy plated material having superior corrosion and heat resistances by operation at a low temp. and a practical current density by blending Ti with specified amounts of Mn and Al. CONSTITUTION:The composition of a material forming a film by electroplating with a molten salt bath is composed of 1-80wt% Ti, 0.2-10wt% Mn and the balance essentially Al. When this ternary alloy is used, a Ti alloy plated material having superior corrosion and heat resistances is obtd. in a densely and smoothly electrodeposited state at a low cost by operation at a low bath temp. of =about 300 deg.C and a practical current density of =5A/dm2.
机译:目的:通过在低温下操作,获得具有优异的耐腐蚀和耐热性的致密且光滑的钛合金镀层材料。通过将Ti与指定量的Mn和Al混合来获得实用的电流密度。组成:用熔融盐浴电镀形成膜的材料的成分由1-80wt%的Ti,0.2-10wt%的Mn和其余的基本上为Al组成。当使用这种三元合金时,将获得具有优异的耐腐蚀性和耐热性的钛合金镀层材料。通过在低浴温下操作以低成本在致密且平滑的电沉积状态下进行沉积。 ≤300℃,实际电流密度≥5A/ dm 2。

著录项

  • 公开/公告号JPH0713316B2

    专利类型

  • 公开/公告日1995-02-15

    原文格式PDF

  • 申请/专利权人 住友金属工業株式会社;

    申请/专利号JP19850100151

  • 发明设计人 内田 淳一;渋谷 敦義;

    申请日1985-05-11

  • 分类号C25D3/66;

  • 国家 JP

  • 入库时间 2022-08-22 04:26:58

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