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METHOD OF FORMING THIN FILM OF STRAIN HETERO SUPERLATTICE STRUCTURE

机译:应变异质超晶格结构的薄膜形成方法

摘要

PURPOSE: To obtain a thin film being excellent in the sharpness and flatness of an Si/Si-Ge hetero interface by a method wherein after an SiOx film is formed on an Si-Ge layer, a reaction furnace is evacuated to be vacuum, the SiOx film is removed by prescribed heating and an Si layer is formed on the Si-Ge layer wherefrom the SiOx film is removed. ;CONSTITUTION: An Si-Ge layer 12 is formed on a substrate 10 and a reaction furnace is evacuated so that vacuum be 1×10-6 to 1×10-4Pa. On the Si-Ge layer 12, thereafter, an SiOx film (0.8x≤1.5) 14 of a film thickness l to 4nm is formed with a mixed gas of a dilution oxygen-series gas and a silicon- containing group IV-series hydrogen gas used and by prescribed heating. After the reaction furnace is evacuated to be vacuum so that the vacuum be made 1×10-8Pa at the maximum, moreover, the SiOx film 14 is removed by prescribed heating. An Si layer 16 is formed on the Si-Ge layer 12 wherefrom the SiOx film 14 is removed.;COPYRIGHT: (C)1995,JPO
机译:目的:通过在Si-Ge层上形成SiO x 膜后进行反应的方法,获得具有优异的Si / Si-Ge异质界面清晰度和平坦度的薄膜。将炉子抽真空至真空,通过规定的加热除去SiO x 膜,并在Si-Ge层上形成Si层,并从中除去SiO x 膜。 ;组成:在衬底10上形成Si-Ge层12并抽空反应炉,使真空度从1×10 -6 到1×10 -4 霸此后,在Si-Ge层12上,用稀释氧系列气体和混合氧气的混合气体形成膜厚为1至4nm的SiO x 膜(0.8 -8 Pa,此外,按规定除去SiO x 膜14。加热。在Si-Ge层12上形成Si层16,从该Si-Ge层12上去除SiO x 膜14。版权所有:(C)1995,JPO

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