首页> 外国专利> POLISHING METHOD, MAGNETIC HEAD OBTAINED BY THE METHOD, X-RAY PARALLELED MEMBER AND X-RAY REFLECTION MEMBER HAVING SURFACE POLISHED BY THE METHOD, AND POLISHING MATERIAL USED FOR THE METHOD

POLISHING METHOD, MAGNETIC HEAD OBTAINED BY THE METHOD, X-RAY PARALLELED MEMBER AND X-RAY REFLECTION MEMBER HAVING SURFACE POLISHED BY THE METHOD, AND POLISHING MATERIAL USED FOR THE METHOD

机译:抛光方法,采用该方法获得的磁头,对该方法进行了表面抛光的X射线辐射会员和X射线反射会员以及用于该方法的抛光材料

摘要

PURPOSE: To smoothly polish copper or alloy mainly comprising copper by providing polishing material comprising a colloidal suspension, demineralized water, and a chemical activator. ;CONSTITUTION: To obtain a polished surface, polishing material and a surface 5a to be polished are moved to each other while polishing pressure is applied, so the surface 5a of copper or alloy mainly comprising copper is polished. At this time, a composition of polishing components containing a colloidal suspension of SiO2 particles having an average particle size of 20-50 nm existing in alkali solution, demineralized water, and a chemical activator is used as the polishing material, the polishing pressure of 400-600 g/cm2 is applied by a polishing material base to absorb the polishing material, and the polishing material base has a hardness in a range from 40 Shore A hardness to 90 Shore D hardness. In addition, 60-100 pts.vol. of the demineralized water and 25-50 pts.vol. of the chemical activator are used per 100 pts.vol. of the polishing components.;COPYRIGHT: (C)1995,JPO
机译:目的:通过提供包含胶体悬浮液,软化水和化学活化剂的抛光材料来平滑抛光铜或主要包含铜的合金。 ;组成:为了获得抛光的表面,在施加抛光压力的同时使抛光材料和要抛光的表面5a彼此移动,从而对铜或主要包含铜的合金的表面5a进行抛光。此时,使用包含碱溶液中存在的平均粒径为20-50nm的SiO 2 颗粒的胶体悬浮液,软化水和化学活化剂的抛光组分的组合物。抛光材料,通过抛光材料基体施加400-600 g / cm 2 的抛光压力以吸收抛光材料,并且该抛光材料基体的硬度在40邵氏A硬度范围内达到90邵氏D硬度。此外,还有60-100点体积。脱盐水和25-50 pts.vol。每100 pts.vol使用1的化学活化剂。 ;版权所有。(C)1995,日本特许厅

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