首页> 外国专利> ELECTROLYTE FOR ELECTROPLATING TIN AND PROCESS FOR HIGH SPEED ELECTROPLATING USING THE SAME

ELECTROLYTE FOR ELECTROPLATING TIN AND PROCESS FOR HIGH SPEED ELECTROPLATING USING THE SAME

机译:用于电镀锡的电解液和使用该电解液的高速电镀工艺

摘要

PURPOSE: To obtain an electrolyte solution for tin electroplating having an improved resistance against oxidation of tin by preparing the electrolyte solution with water, a soluble stannous (tin II) compound, a soluble alkyl sulfonic acid, a wetting agent and a position isomer of a dihydroxybenzene. ;CONSTITUTION: The electrolyte solution for tin electroplating is prepared with water, a specific amount of a soluble tin (II) compound, a soluble alkylsulfonic acid (methane sulfonic acid) in an amount sufficient to provide a solution bath with pH substantially ≤3, a wetting agent and a position isomer of dihydroxybenzene (resorcinol) in a sufficient amount for preventing or suppressing the oxidation of tin (II) into tin (IV), thereby the electrolyte with an improved resistance against oxidation of tin is obtained so that a high speed tin electroplating on the base material is possible.;COPYRIGHT: (C)1995,JPO
机译:用途:通过用水,可溶亚锡(锡II)化合物,可溶烷基磺酸,润湿剂和铜的位置异构体制备电解液,以获得具有改进的抗锡氧化性的电镀锡用电解液。二羟基苯。 ;组成:用于电镀锡的电解液是用水,一定量的可溶性锡(II)化合物,可溶性烷基磺酸(甲磺酸)的量足以提供pH值≤3的溶液浴制备的,足够量的二羟基苯(间苯二酚)的润湿剂和位置异构体,用于防止或抑制锡(II)氧化成锡(IV),从而获得具有提高的锡抗氧化性的电解质,可以在基材上进行快速锡电镀。;版权所有:(C)1995,JPO

著录项

  • 公开/公告号JPH07197289A

    专利类型

  • 公开/公告日1995-08-01

    原文格式PDF

  • 申请/专利权人 LEARONAL INC;

    申请/专利号JP19940318994

  • 申请日1985-12-28

  • 分类号C25D3/32;

  • 国家 JP

  • 入库时间 2022-08-22 04:23:43

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