HYDRODYNAMIC ELECTROLYTE CONTROL FOR EFFICIENTLY TRANSFERRING SUBSTANCE IN ELECTROPLATING PROCESSHYDRODYNAMIC ELECTROLYTE CONTROL FOR EFFICIENTLY TRANSFERRING SUBSTANCE IN ELECTROPLATING PROCESS

摘要

Disclosed are an apparatus for electroplating one or more metal on a substrate, and a method therefor. An embodiment comprises the electroplating method for efficiently transferring a substance, and the apparatus therefor to obtain a highly uniform plated layer. According to the specific embodiment, transferring at a great quantity is achieved by combining collisions and shears on a surface of a wafer.;COPYRIGHT KIPO 2017