SURFACE TREATMENT FOR STAINLESS STEEL MATERIAL FOR SEMICONDUCTOR-MANUFACTURING EQUIPMENT

摘要

PURPOSE: To obtain a surface treated stainless steel excellent in corrosion resistance even to halogen gas, such as Cl₂, HCl, and F₂, having smooth surface, hardly causing adsorption of moisture, etc., and having superior properties required of material for semiconductor-manufacturing equipment. ;CONSTITUTION: The surface of a stainless steel material is mechanically ground by using abrasive grains of 1-10μm grain size and the half-width 2θ of diffraction lines in the 111 plane of austenitic iron, by X-ray diffraction, in the working strain layer formed on the surface is regulated to ≥0.5°, and then, heating treatment is done in an atmosphere of low partial pressure of oxygen, by which an oxide film composed essentially of Cr, having ≥200Å thickness and ≤1μm surface roughness R_max, can be formed. By this method, the denser oxide film enriched in Cr can be formed.;COPYRIGHT: (C)1994,JPO