首页> 外国专利> OXYGEN CONCENTRATION ANALYSIS METHOD FOR SOLDERING DEVICE IN SOLDERING N2 ATMOSPHERE

OXYGEN CONCENTRATION ANALYSIS METHOD FOR SOLDERING DEVICE IN SOLDERING N2 ATMOSPHERE

机译:氮气氛焊接中的氧浓度分析方法

摘要

PURPOSE: To use a zirconia type oxygen densitometer normally unusable for measuring the oxygen concentration of gas in soldering atmosphere, and undertake the proper control of the oxygen concentration in the soldering atmosphere for restraining the occurrence of a solder defect. ;CONSTITUTION: Atmosphere gas is sampled from a soldering furnace 1 and a resin component is removed therefrom via a filter 2. Then, an alcohol component is removed from the gas through a filter 4 and subsequently moisture is removed via a mist separator 5. The oxygen concentration of the gas so produced is measured with a zirconia type oxygen densitometer 6.;COPYRIGHT: (C)1995,JPO
机译:目的:使用通常无法用于测量焊接气氛中气体的氧气浓度的氧化锆型氧气密度计,并对焊接气氛中的氧气浓度进行适当控制,以抑制焊料缺陷的发生。 ;组成:从焊接炉1取样大气气体,并通过过滤器2除去树脂成分。然后,通过过滤器4从气体中除去醇成分,然后通过雾气分离器5除去水分。如此产生的气体中的氧气浓度用氧化锆型氧气密度计6进行测量。版权所有:(C)1995,JPO

著录项

  • 公开/公告号JPH0783868A

    专利类型

  • 公开/公告日1995-03-31

    原文格式PDF

  • 申请/专利权人 OSAKA ASAHI KAGAKU KK;DAIICHI NETSUKEN KK;

    申请/专利号JP19930189313

  • 发明设计人 HIRATA TOSHIO;

    申请日1993-06-30

  • 分类号G01N27/28;B23K31/02;G01N1/00;G01N27/409;

  • 国家 JP

  • 入库时间 2022-08-22 04:22:45

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